5Ghz + submisions with Asrock motheboards |
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wardog
Moderator Group Joined: 15 Jul 2015 Status: Offline Points: 6447 |
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kleshas_priest
Newbie Joined: 30 Nov 2016 Location: Japan Status: Offline Points: 1 |
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Nice to meet you,wardog ah.... I may not explain it well Well...At first from a CPU : Heat spreader which was made with press machine : see it horizontally : But In fact, a rim swells : center of heat spreader of the CPU becomes dented. : Therefore I sharpen it evenly in oil Stone. (It took approximately 24 hours until it became level.) : Please image it so that it is parallel to silicone die then. : I exclude heat spreader. : I Application a silicon die with LIQUID PRO of Cool Laboratory company. It is cooler next : A contact surface of MasterAir Maker 8. : But it is a curved surface plenty.Therefore I sharpen it in an oil stone. : The vapor chamber part which was welded to the backside the surface swell into a punctiform. : I confirm it using red lead(or minium) : Only the point touch a CPU. : Therefore...not surface contact with a CPU. : In an Oil Stone,I revise it. : Apply LIQUID PRO and make modifications : Then attached to a CPU When I say Why you do it When I use the CPU grease of the liquid metal and.... : fan is a double side in cooler. COSAIR SP120 High Performance Edition High Static Pressure : case is Thermaltake Core X9 The image that is in the middle of still building it One to write English is difficult than I sharpen a CPU (lol
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Xaltar
Moderator Group Joined: 16 May 2015 Location: Europe Status: Online Points: 24713 |
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In English we call sanding/smoothing the CPU heat spreader and CPU cooler contact surface Lapping
You also delidded the CPU and replaced the thermal compound with higher grade material, great stuff! Thanks for sharing the pics A lot of people seem to think you need a mirror finish on a Lap job but the truth is, all you need is an even surface with maximum contact between the CPU and cooler. In some cases, given high quality thermal compound a rougher finish actually provides better thermal contact as the paste gets into the fine grooves. In all my testing with lapping I found it made very little difference, rough finish or mirror when it comes to cooling performance. The only thing I found interesting was when I mirror finished both my CPU and cooler (an old P4 B 2.4ghz) I was able to use them with no thermal compound with no ill effect. The 2 would actually stick together if you removed all the air from between them. It takes a lot of patience to do so anyone reading this take note, you can't rush this kind of thing or you will end up ruining it.
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wardog
Moderator Group Joined: 15 Jul 2015 Status: Offline Points: 6447 |
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I absolutely love my Core X9
Not since my old Packard Bell 486DX25 have I had the pleasure of working on a horizontal motherboard. And what with the X9's side and top panels being removable I now have room for both elbows in there. And unfortunately both thumbs too |
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wardog
Moderator Group Joined: 15 Jul 2015 Status: Offline Points: 6447 |
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Xaltar, the way read his post there just now he has mistakenly re-applied the factory heat spreader back over his die. If so, that is most likely causing his temps to reflect what they are. Simply lapping the heat spreader and be dome with it. Yet he also shows removing it and applying Coollaboratory to the top of the die also. Stp at one or the other. But not both. That's a recipe for diasas........... Heat! |
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wardog
Moderator Group Joined: 15 Jul 2015 Status: Offline Points: 6447 |
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wardog
Moderator Group Joined: 15 Jul 2015 Status: Offline Points: 6447 |
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This is with all 8 cores of the FX-9590 running, as set in the BIOS, at 200x25
Motherboard: ASRock 990FX Extreme9, BIOS P1.80 Processor: AMD FX-9590 Processor Multi set to 25 LLC set at 75% Memory: 16Gb(2x8) of 32GB(4x8) G.Skill F3-2133C10Q-32GSR Kit Memory set to XMP Profile 2, Extreme Profile, 2133 Mhz 10-12-12-31 1T Memory residing in slots A2 and B2 Corsair H115i set at Balanced Windows Power set to Performance C States disabled in BIOS CPU/NB +.05v, from +1.25v to +1.30v Remaining parts are: Fractal Design Define S w/H115i rad on top exhausting PNY XLR8 1050Ti Seasonic SS-850KM3 Samsung 850 EVO 500Gb and 1TB These were the only changes in the BIOS and Windows. All else in BIOS set to Auto, except where needed to make Multi and Voltage changes. Next up is 5.1Ghz Edited to get pic proper Edited by wardog - 11 Dec 2016 at 1:08pm |
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parsec
Moderator Group Joined: 04 May 2015 Location: USA Status: Offline Points: 4996 |
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I'm supposed to comment on the temperatures, since I'm a naysayer about AMD processor temperatures of some sort, according to wardog.
So I'll remain in Naysayer mode, with a capital N. I am good at that, learned it from my father. As he would say, "I'm not prejudiced, I hate everyone". A more accurate term would be cynic. So full cynic mode it is! So we have a full 5GHz submission here... hmm, isn't 5GHz the stock Turbo speed of the FX-9590? Yes it is. Oh wait, I see you hit 5,053.5MHz when the Buss Clock hit 202.1MHz, as it wandered around a bit. The thread title is 5GHz + submissions, so that has been achieved. Now temperature time. But the question is, what to comment on? AMD processor temperature readings are done differently than Intel. Intel has no concept of the "socket temperature", and which temperature readings HWiNFO64 assigns to its various labels for AMD processors is not obvious, IMO. For example, the CPU Package temperature is normally the highest temperature reading for an Intel processor. That can be the highest single core temperature of an Intel processor, but is higher than that temperature for the HEDT processors, up to ~10C, although that levels out as the core temperatures approach their maximum, 100C for most Intel processors, 105C for HEDT processors. The maximum specified temperature of an FX-9590 is... not easy to find. The CPU Package temperature, as I saw with my FX-9590, are impossibly low. Mine at idle would show single digit values, sub-ambient. That must really be a delta above some base value, which might be the ambient or possibly socket temperature. The maximum value there of 46C would seem to be very close to a delta above the socket ambient temperature, of ~20C. The other CPU temperature shows a maximum of 59.5C, which is mighty fine for a VCore of 1.552V. We don't see CPU core usage quite at 100%, but very close. Time for an OC, I look forward to seeing that! |
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wardog
Moderator Group Joined: 15 Jul 2015 Status: Offline Points: 6447 |
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Careful there. You're showing your AMD Noobness. AOD > CPU Status - Thermal Margin To the rest of that you posted above, running all 8 cores at 5.0 and above is a feat. A feat of the motherboard as well seeing I far exceeded the 220W TDP by doing 5.0 on 8. Stock 4.7 to 4.75 its running 8 cores but above 4.75 it begins dropping the least productive cores to focus on 4 then 2(?) cores. I'm coming to the conclusion you hold something against AMD ....... |
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Xaltar
Moderator Group Joined: 16 May 2015 Location: Europe Status: Online Points: 24713 |
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http://hexus.net/tech/news/cpu/100726-intel-core-i7-7700k-overclocked-beyond-7ghz/
2.0v core voltage Even on LN2 that makes me cringe
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