Hello, I', upgrading motherboard will the following RAM module work with the H61M-VG4 or the H61M-GS or the H61M-DGS? ----------------------------------------------------------------------------------------------------------------------------- ------------------------------------------------------------------------------------------------------------------------------------------------------------- tem | Slot #1 | -------------------------------------------------------------------------------|-----------------------|-----------------|-----------------|-----------------|- Ram Type | DDR3 | Maximum Clock Speed (MHz) | 667 (JEDEC) | | | | Maximum Transfer Speed (MHz) | DDR3-1333 | | | | Maximum Bandwidth (MB/s) | PC3-10600 | | | | Memory Capacity (MB) | 4096 | | | | Jedec Manufacture Name | Micron Technology | | | | Search http://amazon.com/" rel="nofollow - Amazon.com | Search! | | | | SPD Revision | 1.0 | | | | Registered | No | | | | ECC | No | | | | DIMM Slot # | 1 | | | | Manufactured | Week 8 of Year 2011 | | | | Module Part # | 16JTF51264AZ-1G4D1 | | | | Module Revision | 0x4431 | | | | Module Serial # | 0xDE6F5EC0 | | | | Module Manufacturing Location | 15 | | | | # of Row Addressing Bits | 15 | | | | # of Column Addressing Bits | 10 | | | | # of Banks | 8 | | | | # of Ranks | 2 | | | | Device Width in Bits | 8 | | | | Bus Width in Bits | 64 | | | | Module Voltage | 1.5V | | | | CAS Latencies Supported | 5 6 7 8 9 10 | | | | Timings @ Max Frequency (JEDEC) | 9-9-9-24 | | | | Maximum frequency (MHz) | 667 | | | | Maximum Transfer Speed (MHz) | DDR3-1333 | | | | Maximum Bandwidth (MB/s) | PC3-10600 | | | | Minimum Clock Cycle Time, tCK (ns) | 1.500 | | | | Minimum CAS Latency Time, tAA (ns) | 13.125 | | | | Minimum RAS to CAS Delay, tRCD (ns) | 13.125 | | | | Minimum Row Precharge Time, tRP (ns) | 13.125 | | | | Minimum Active to Precharge Time, tRAS (ns) | 36.000 | | | | Minimum Row Active to Row Active Delay, tRRD (ns) | 6.000 | | | | Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 49.125 | | | | Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 160.000 | | | | | | | | | DDR3 Specific SPD Attributes | | | | | Write Recovery Time, tWR (ns) | 15.000 | | | | Internal Write to Read Command Delay, tWTR (ns) | 7.500 | | | | Internal Read to Precharge Command Delay, tRTP (ns) | 7.500 | | | | Minimum Four Activate Window Delay, tFAW (ns) | 30.000 | | | | RZQ / 6 Supported | No | | | | RZQ / 7 Supported | Yes | | | | DLL-Off Mode Supported | Yes | | | | Maximum Operating Temperature Range (C) | 0-95 | | | | Refresh Rate at Extended Operating Temperature Range | 2X | | | | Auto-self Refresh Supported | Yes | | | | On-die Thermal Sensor Readout Supported | No | | | | Partial Array Self Refresh Supported | No | | | | Thermal Sensor Present | No | | | | Non-standard SDRAM Type | Standard Monolithic | | | | Module Type | UDIMM | | | | Module Height (mm) | 30 | | | | Module Thickness (front), (mm) | 2 | | | | Module Thickness (back), (mm) | 2 | | | | Module Width (mm) | 133.5 | | | | Reference Raw Card Used | Raw Card B Rev. 0 | | | | DRAM Manufacture | Micron Technology | | | | -------------------------------------------------------------------------------------------------------------------------------------------
Thanks in advance
|