AB350M pro4 vrm

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   I removed a VRM heatsink from a different ASRock board, and I'd say the thermal pads were ½mm thick.

That type of material is rather soft and compresses easily, so a 1mm pad would likely work fine too.

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parsec Members Profile Send Private Message Find Members Posts Add to Buddy List Moderator Group Joined: 04 May 2015 Location: USA Status: Offline Points: 4996	Post Options Post Reply Quote parsec Report Post Thanks(0) Quote Reply Topic: AB350M pro4 vrm Posted: 07 May 2017 at 7:34am
	I removed a VRM heatsink from a different ASRock board, and I'd say the thermal pads were ½mm thick. That type of material is rather soft and compresses easily, so a 1mm pad would likely work fine too.


wardog Members Profile Send Private Message Find Members Posts Add to Buddy List Moderator Group Joined: 15 Jul 2015 Status: Offline Points: 6447	Post Options Post Reply Quote wardog Report Post Thanks(0) Quote Reply Posted: 07 May 2017 at 1:21am
	ie: 0.5mm or 1mm is fine between the processor and it's heatsink.

wardog Members Profile Send Private Message Find Members Posts Add to Buddy List Moderator Group Joined: 15 Jul 2015 Status: Offline Points: 6447	Post Options Post Reply Quote wardog Report Post Thanks(0) Quote Reply Posted: 07 May 2017 at 1:19am
	Considering 1mm is 0.0397in I'd shoot for something thicker. I see they're push pinned down. Manufacturing differences across the tops of the VRMs I would imagine be greater than 1mm. Which would certainly leave a gap over one or more, and making no contact whatsoever.

KazadorI Members Profile Send Private Message Find Members Posts Add to Buddy List Newbie Joined: 27 Apr 2017 Status: Offline Points: 16	Post Options Post Reply Quote KazadorI Report Post Thanks(0) Quote Reply Posted: 06 May 2017 at 7:21pm
	down anyone know the thickness of the vrm thermal pad? i was looking at replacing it with a high performance pad such as " Fujipoly Ultra Extreme " which has a Thermal Conductivity 17.0 W/mK but it comes in .5 or 1.0 mm thickness and im not sure which one to get.