Fatality k6 z170 - kaby lake dont recognize sli

Just updating good folks, i checked my bios, it was actually 7.0.
Once i updated with the uefi internet update it worked like a champ.
Very nice indeed, i really apreciate that even mid tier boards like this one have dual bios.

The only thing i miss on the current bios is the option to set a negative multiplier to AVX, but its all fine.

parsec wrote: postem wrote: Just updating good folks, i checked my bios, it was actually 7.0. Once i updated with the uefi internet update it worked like a champ. Very nice indeed, i really apreciate that even mid tier boards like this one have dual bios. The only thing i miss on the current bios is the option to set a negative multiplier to AVX, but its all fine. The only AVX related multiplier setting I've seen is a (negative) offset setting for the processor Cache multiplier, when AVX instruction are being executed. That's available on a ASRock Z270 board's UEFI/BIOS. Is that what you mean by a negative multiplier?

Yes that setting. It seen for now only bios running it are the 270 ones.
Not much of a problem anyway, i dont plan to use avx for extended periods, and this fatality board, even being z170 seen to scale nicely with oc.

Gonna start ramping the cpu clocks now to find what i can find before delid.

parsec wrote: Actually, that option seems to affect both the core and cache multipliers, not just the cache multiplier. I believe it is X99/Broadwell-E HEDT systems that only reduces the cache multiplier with AVX instructions. It sounds like you have used a delidded CPU in the past. Do you go bare die, or use the IHS compressed by the socket latch mechanism? If bare die, do you use anything around the die as a spacer, and/or for protection?

Yep that avx offset should affect both, but im not much worried about the lack of it.

From delliding, i heard of very few people doing it without the IHS since ivy bridge. Its not worth the risk, and the trouble, because you need to replace the heatsink mount, since the bare die is a tid lower, and there is a big risk of cracking the die with the mount pressure if you dont do it very even, and also the issues with thinner skylale/kaby pcb.

IMO its not worth the risk to run the die without the IHS. Just put it back floating on the retention or reseal using silicone glue or another removable adhesive.