AR Fatal1ty 970 Performance- RAM compatibility

If it's the Hyper TX3 with wire fan securements you should be good

http://www.coolermaster.com/cooling/cpu-air-cooler/hyper-tx3-with-fan-bracket/

That Noctua NH D14 is, IMO, overkill unless you plan on pushing some serious voltage into the CPU. That, and I forget what the maximum HS/F weight safely allowed is on AMD motherboards but I'm guessing the D14 comes close, if not over.

Concerning the CPU FAN I don't know if there is something wrong... Indeed this morning HWMonitor didn't register any RPM from the CPU FAN (I didn't check if the Fan was turning or not), which makes sense since the temp didn't exceed 45C.

PetrolHead wrote: If you think there's a problem with your CPU (package) temperatures, you can find a lot of instructions online about how to apply the so called TIM between the CPU and the heatsink. I personally prefer to spread a very thin layer on the CPU (or the heatsinki, depending on which one has a smaller surface area). Many people swear by the "pea method" or "rice grain method", however.

Count me as one of the blob folks.

Back in the old "CPUs ran hotter than hell' days I became a convert. IMO, in MY opinion and experiences, spreading it prior to fitting sometimes allows for air pockets to form in the paste/TIM between the processor and sink when the sink is secured.

While the round blob method you do need to be careful in fitting and securing, as the blob is pressed outwards no air pockets will form as it is continually coursing towards the outer periphery. Carfeful as you apply the sink that you apply even and level pressure while lowering the sink.

My 2cents anyways.

dinin70 wrote: Concerning the PSU, yes the fan is turning and the airflow is rather cool. But what is the AUXIN? Isn't it the chipset? Maybe the CPU needs some extra Thermal glue...

It's the AUXTIN (notice the T), and it means auxiliary temperature index. It's basically just a label that the program has assigned some sensor by what it thinks it is. It's supposed to be the PSU temperature sensor, but there may not even be one. If the airflow is rather cool, then I doubt those numbers are correct. The AUXTIN value on my system is 25 C +- 1 C no matter what I do, and the airflow coming from the PSU is cool.

The chipset (NB) is likely SYSTIN, CPUTIN is the socket and TMPIN3 is a mystery to me.

About the thermal "glue", you should have the least amount possible of it between the CPU and the cooler. This is because it doesn't conduct heat very well (compared to aluminium or copper, at least). The reason it is used at all is because it conducts heat a lot better than air, which is what you'd otherwise have between the CPU and the heatsink, trapped in the small imperfections of the surfaces. An _extra_ layer of thermal glue will thus make your CPU run hotter if the current one is fine. A _new_ layer may make it run cooler, if the current layer is not fine. If you think there's a problem with your CPU (package) temperatures, you can find a lot of instructions online about how to apply the so called TIM between the CPU and the heatsink. I personally prefer to spread a very thin layer on the CPU (or the heatsinki, depending on which one has a smaller surface area). Many people swear by the "pea method" or "rice grain method", however.

Regarding the temperatures, what is you computer doing when it reaches 53 C on the socket as well as the CPU? Was your system idle when you took a printscreen of this? If yes, do you have a lot of "bloatware" or other stuff that runs on startup?

Hi Wardog,

Edited by dinin70 - 08 Jan 2016 at 4:45am