As far as I am aware the only "issue" has been with cooler mounting pressure which
sadly has been a problem on a lot of LGA CPUs since Skylake (for intel) when they
made the substrate (the green PCB) thinner to "improve efficiency" (save cost).
The thin PCB will tend to flex under pressure so if the mounting pressure is uneven
then you end up with corners lifting off their contacts etc.
An easy way to test for this is to lay the PC on it's side and simply rest the
cooler on top of the CPU with some thermal compound. If you are still having issues
then it isn't mounting pressure. Also check the CPU itself, make sure the PCB is
not warped/bent in any way. The slightest warp can cause issues.
Good luck